Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

نویسندگان

چکیده

Abstract This review introduces relevant nanoscale thermal transport processes that impact abatement in power electronics applications. Specifically, we highlight the importance of mechanisms at each layer material hierarchies make up modern electronic devices. includes those through: (1) substrates, (2) interfaces and two-dimensional materials, (3) heat spreading materials. For layer, provide examples recent works demonstrate improvements performance and/or improve our understanding relevance across junctions. We end discussion by highlighting several additional applications have benefited from a consideration phenomena, including radio frequency (RF) neuromorphic computing.

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Evaluating Broader Impacts of Nanoscale Thermal Transport Research

The past two decades have witnessed the emergence and rapid growth of the research field of nanoscale thermal transport. Much of the work in this field has been fundamental studies that have explored the mechanisms of heat transport in nanoscale films, wires, particles, interfaces, and channels. However, in recent years there has been an increasing emphasis on utilizing the fundamental knowledg...

متن کامل

Probing Nanoscale Thermal Transport in Surfactant Solutions

Surfactant solutions typically feature tunable nanoscale, internal structures. Although rarely utilized, they can be a powerful platform for probing thermal transport in nanoscale domains and across interfaces with nanometer-size radius. Here, we examine the structure and thermal transport in solution of AOT (Dioctyl sodium sulfosuccinate) in n-octane liquids using small-angle neutron scatterin...

متن کامل

Nanoscale thermal transport. II. 2003–2012

Nanoscale thermal transport. II. 2003–2012 David G. Cahill, Paul V. Braun, Gang Chen, David R. Clarke, Shanhui Fan, Kenneth E. Goodson, Pawel Keblinski, William P. King, Gerald D. Mahan, Arun Majumdar, Humphrey J. Maris, Simon R. Phillpot, Eric Pop, and Li Shi Department of Materials Science and Engineering and the Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana, I...

متن کامل

Thermal Transport Mechanisms at Nanoscale Point Contacts

We have experimentally investigated the heat transfer mechanisms at a 90610 nm diameter point contact between a sample and a probe tip of a scanning thermal microscope (SThM). For large heated regions on the sample, air conduction is the dominant tipsample heat transfer mechanism. For micro/nano devices with a submicron localized heated region, the air conduction contribution decreases, whereas...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Journal of Electronic Packaging

سال: 2021

ISSN: ['1528-9044', '1043-7398']

DOI: https://doi.org/10.1115/1.4049293